採用 NXP ARM® i.MX 8M Plus Quad Cortex-A53 處理器的寬溫 NXP i.MX8M架構SMARC 2.1模組

  • NXP i.MX8M Plus Quad Cortex-A53 processor
  • 3GB LPDDR4, 16GB eMMC on board
  • Rich peripheral I/O support
  • Validated with Yocto 2.5 (sumo, kernel 5.4.70) / Android 11
  • Long-term supply with NxP solution
  • Compliant with SMARC™ 2.1 specification
  • Wide Temperature
Form Factor SMARC™ 2.1
Processor NXP i.MX8M Plus Quad Cortex-A53 processor
System Memory 3GB LPDDR4 on board
Flash Memory 16GB eMMC on board (up to 64GB)
Display HDMI, LCVS and MIPI-DSI 4-lane up to 1920 x 1080 at 60 Hz
Video Codec Up to 1080p/60fps video decode, AVC/H.264, HEVC/H.265, VP8, VP9
Up to 1080p/60fps video encode, AVC/H.264, HEVC/H.265
Graphics GC7000UL with OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2 and Vulkan
Audio Interface 2x I²C
LAN GbE with AR8031 LAN PHY on board
USB 2x USB 3.0 with OTG interface
Image Capture Interface 2x MIPI-CSI2 4-lane + 2-lane
Serial Interface 4x UART, 2x SPI
Media Interface 3x High-speed SDIO
PCI-E 1x PCI-E interface
I²C 4x I²C
Others N/A
Dimensions 82mm x 50mm (3.2” x 2”)
Environment Humidity: 0 % to 90 % RH at 60° C (non-condensing)
Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis)
Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins
Operating Temperature -40°C~+85°C (-40°F ~ 185°F)
OS Support Yocto 2.5 (sumo, kernel 5.4.70) / Android 11
Other OS (by request)
Certification CE/ FCC Class A
RM-N8MP-Q308I NXP i.MX8M Plus Quad Cortex-A53 1.8GHz processor, 3GB LPDDR4, 8GB eMMC
F8Sxx-HSK Heat sink
產品資料表 RM-N8MP
產品型錄 RISC-Based Embedded Solutions (Vol.24.03)

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