嵌入式系統

AMI230

搭載第9/8代 Intel® Core™ i7/i5/i3 桌上型處理器(35W TDP)的擴充型無風扇嵌入式系統

  • Fanless system with IBASE MB230 customized board
  • 9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors
  • Dual SIM slots support WWAN redundancy
  • 4x RJ45 Gigabit Ethernet port (2x support 802.3at PoE+)
  • 3x M.2 (B-Key/E-Key/M-Key)
  • Supports Over/Under/Reverse voltage protection
  • iSMART, iAMT (11.6), TPM (2.0)
  • 15 years life time
  • iSMART
  • Fanless
  • IEC 62368-1 EN 62368-1
  • IP40
  • 2021 Taiwan Excellence

AMI230是廣積專為智慧工廠、工業自動化、AIoT以及相關領域所量身打造的工業級強固型嵌入式電腦系統,可運用於AI工智慧檢測以及IoT物聯網等各式應用。搭配PoE+網路線供電設備,可外接鏡頭進行人工智慧視覺、聽覺辨識技術,其寬溫無風扇的設計,讓系統在-20°C到70°C的高低溫嚴酷環境下亦能正常運作。本系統採用第9/8代Intel® Core™ 35W Desktop中央處理器架構,為確保可在惡劣環境下穩定運作,其支援廣積iSMART智慧節能技術,可提供自動開關機排程、電源自動回復、並可在低溫環境下重新啟動,以達到全方位的保護機制並完美展現高效的運算以及繪圖能力。此外,AMI230可提供電壓過載保護、過低電壓保護、反向電壓保護加強其安全性,開機操作中仍符合3Grms/3~500Hz的耐振度保護且能持續正常運作。AMI230系統亦提供三個M.2插槽,可外接4G/LTE或WiFi模組,或支援NVMe SSD供儲存資料用。另外,為因應不同的應用需求,亦可搭配相對應的RISER CARD,大大的提升了產品使用的彈性和便利性。除此之外,本產品採用整機系統驗證測試CE/FCC安全認證,可以解決客戶在各式惡劣環境的運作問題,並提高使用的安全性。


System Mainboard MB230AF with Intel® Q370 PCH
CPU Type 9th/8th Gen Intel® CoreTM i7/i5/i3 desktop processors
System Speed Up to 4.0 GHz
Memory 2x DDR4-2666/2400 SO-DIMM, Max. 32GB
Front Panel External I/O 1x DVI-D + HDMI(1.4)
4x USB 3.1 ports
2x Antenna holes
2x RJ45 Gigabit Ethernet ports + dual USB 3.1 stack ports
1x Red HDD LED
1x Power button with Green LED indicator
1x 2-pin terminal block
2x SIM card
Rear Panel External I/O 2x RS232/422/485 port for COM#1~COM#2
2x RS232 ports for COM#3~COM#4
1x DisplayPort (1.2)
2x RJ45 Gigabit Ethernet port (supports 802.3at PoE+)
1x 5-pins DC-in terminal block type for 12V (±10%) or 18V (-10%)~24V (+10%)
2x Antenna holes
Expansion Slots 1x M.2 (B-Key supports USB 2.0 for 4G/LTE)
1x M.2 (E-Key supports PCI-E + USB 2.0 for CNVi)
1x M.2 (M-Key supports PCI-E(4x) + SATA for NVMe SSD)
Storage 1x 2.5'' HDD/SSD, M.2 (M-Key)
Construction Aluminum & steel
Chassis Color Silver & Gray
Mounting Desktop & wall mount
Dimensions 210mm (W) x 285mm (D) x 77mm (H)
8.27" (W) x 11.22" (D) x 3.03" (H)
Weight 4kg
Operating Temperature -20°C to 70°C (-4°F~158°F) (for 35W CPU)
Storage Temperature -20°C~80°C (-4°F~176°F)
Relative Humidity 5~90% @60°C, (non-condensing)
Vibration Operating: 3Grms / 5~500Hz
Shock Operating: 20G / 11ms
Non-operating: 40G / 11ms
Certification CE/ FCC Class A/ LVD
AMI230AF (Supports Sierra module) Fanless box System with MB230AF, w/ Intel® Core™ i7/i5/i3 desktop Processor, 4x COM, 1x 8GB memory, 1x 2.5” 64GB MLC industrial-grade SSD, w/o power adaptor
270W Power Adaptor Kit (optional) 270W (24V@11.25A) power adaptor kit Compatible with IEC62368-1/EN62368-1
Optional Accessories Global 4G antenna kit for Sierra Wireless EM7565 module, M.2 (M-Key 2280) Thermal kit
產品資料表 AMI230
產品型錄 Intelligent Systems (Vol.05)
使用手冊 AMI230/AMI231/AMI232

驅動程式

Model Chipset Video Audio Network Others
AMI230/AMI231/AMI232

Intel(R) Chipset Software Installation Utility

Windows10

Intel(R) HD Graphics

Windows10

Realtek High Definition Audio

Windows10

Intel(R) Network

Windows10

Intel(R) ME 12.X

Windows10

註冊成為廣積會員,您將能夠從我們的會員專區直接下載產品測試報告、認證文件、2D/3D 檔案以及 MTBF 報告等資料。立即 加入會員!