Fanless Motion Control System with 7th/6th Gen Intel® Core™ i7/i5/i3 Desktop Processors

Fanless motion control system with IBASE MB300-TLP customized boardSupports 7th/6th Gen Intel® Core™ i7/i5/i3 processors2MB MRAM module (optional)Front removable drive bay for HDD/SSD (supports RAID 0/1)4 Axis Pulse Command Motion Control80 ch. Isolated Digital I/O (48 ch. DI / 32 ch. DO)Over/Under/Reverse voltage protectionSupports DIN-rail mount & wall mountiSMART, iAMT (11.6)

MAI602-M4D80是一台為設備自動化市場應用領域所設計的運動控制專用無風扇系統,其整合運動控制所需的各種功能,可依照客戶使用需求搭載7th/6th Intel Core 35W處理器,能為客戶提供出色的計算能力,其內置搭配的4軸馬達控制PCIe卡,可滿足控制高性能伺服/步進馬達和定位精度的需求。且其馬達控制PCI卡上相機觸發訊號的功能能結合視覺檢測的應用,提供給80點帶隔離數位訊號PCIe卡,以達到控制及監控週邊數位訊號開關及警報訊號的控制功能。另外,可利用主板上Mini PCI-E選擇搭配廣積Field Bus MotionNET 模組,來擴展I/O及馬達控制,系統內提供一組USB插座,方便客戶隱藏USB dongle,並能在不影響現有裝置的情況下擴充增加功能,提高便利性。為因應不同產線應用的環境,本系統在設計時即以小型化、散熱快速以及安裝方便為設計目標,因此在機構外殼以開孔設計讓系統內部能形成熱流動,並在散熱鰭中加入導熱管,能有效的加速散熱速度降低系統溫度。此外,為了提升使用者在硬體安裝上的方便性及擴充產的相容性,系統的I/O介面在規劃之初即要求同一個面,以利使用者安裝線路走線的配置規劃,另為縮小產品所佔空間,本產品的擴充模組走線則是以側邊開孔出線方式,並通過CE/FCC安全認證及整機系統相容性測試,可解決客戶模組相容性問題,提高使用的安全性。

The MAI602-M4D80 is a motion control system that can be used in various factory production applications such as automated optical inspection, semiconductor wafer handling, packaging and material handling systems.

It is powered by 7th/6th Gen Intel® Core™ i7/i5/i3 desktop processors and has a 4-axis motion control PCIe card that meets the performance and positioning accuracy requirements of high-performance servo/step motors. For use in visual inspection applications, the motion control card has a camera integrated with a position comparison trigger. The system comes with a built-in 80-ch isolated digital I/O card to control and monitor the switches of surrounding digital signals and control the alarm signals. Another model, "MAI602-B", has two slots (PCIe x8 & PCIe x4 slot) to accommodate different control cards. In addition, the Mini PCI-E on board supports IBASE's Field Bus MotionNET modules for extra I/O and motion control functionalities.

The rugged MAI602-M4D80 is a fanless, compact system designed to operate at an ambient temperature of up to 50 degrees Celsius in a non-airflow environment and has protection against accidental reverse polarity, over voltage or under voltage. The compact system is designed with fast heat dissipation and easy installation, with enclosure vents that allow airflow to the internal components as well a heatpipe mechanism for fast cooling, effectively lowering system temperature. To provide ease in user installation of the hardware, the I/O interface of the system and cable routing have been all positioned on the same side.

The system measures 275mm by 140mm by 117mm and can be installed with the provided wall mount bracket or an optional DIN-rail bracket. Flexible rear I/O interface include DVI and DisplayPort display connectors, audio line-out, two serial ports, two Gigabit Ethernet ports, 2-pin power-button terminal block, and a 3-pin 24V DC-in terminal block.

System Mainboard MB300-TLP with Intel® Q170 PCH
CPU Type 7th/6th Gen Intel® Core™ i7/i5/i3 desktop processors
System Speed Up to 3.4GHz
Memory 2x DDR4-2133 SO-DIMM, Max. 32GB
Construction Aluminum & steel
Chassis Color Sliver + navy blue
Front Panel External I/O 2x Antenna hole for WLAN module
Rear Panel External I/O 1x DVI-I + 1x DisplayPort connector
1x Audio jack for Line-out
4x USB 3.0 ports, 2x USB 2.0 ports
1x Red HDD LED, 1x green power LED
2x Error LED by programming
1x Power button
1x 2-pin terminal block for external power button
1x RS232/422/485 port for COM#1
1x RS232 port for COM#2
2x RJ45 Gigabit Ethernet port
1x 3-pin DC-in terminal block type for 24V
Expansion Slots 1x Mini PCI-E sockets (full-size)
1x 4 Axis Pulse Command Motion Control
1x 80 ch. Isolated Digital I/O (48 ch. DI / 32 ch. DO)
Storage / M.2 2x 2.5” SSD + 1x mSATA socket
Mounting Desktop or wall mounting (wall mount kit included)
Side mounting
DIN-rail mounting (optional)
System Dimensions 275mm (W) x 140mm (D) x 117mm (H)
10.83” (W) x 5.51” (D) x 4.61” (H)
System Operating Temperature -10°C to 60°C (14°F~140°F)*With Air flow
-10°C to 50°C (14°F to 122°F) without Air flow
System Storage Temperature -20°C to 80°C (-4°F to 176°F)
System Relative Humidity 5~90% @ 45°C, (non-condensing)
Vibration Non-Operating: 1.0 grms / 5~500Hz / random operation
Operatiing: 0.25 grms / 5~500Hz / random operation
Certification CE / LVD / FCC Class B
MAI602-M4D80 Fanless system, w/ Intel® Core™ i5-6500TE (2.3GHz) CPU, 2x 4GB DDR4 SO-DIMM, 1x 2.5" 128GB MLC industrial-grade SSD, IP302 riser card, 4 Axis Motion card, 80 ch. Isolated Digital I/O card, w/o power adaptor
Power adaptor 180W(24V @7.5A) power adaptor, bare wire type
Compatible with IEC62368-1/EN62368-1

Model Chipset Video Audio Network Others
MAI602-M4D80 Intel(R) Chipset Software Installation UtilityWindows 7 & 10 Intel(R) HD GraphicsWindows 7 (32Bit) Windows 7 (64Bit) Windows 10 Realtek High Definition AudioWindows 7 & 10 Intel(R) PRO LAN NetworkWindows 7 (32Bit) Windows 7 & 10 (64Bit) Intel(R) ME 11.xWindows 7 Windows 10 Intel(R) USB 3.0Windows 7 Motion cardWindows 7 & 10 (32Bit) Windows 7 & 10 (64Bit) Digital cardWindows 7 & 10 (32Bit) Windows 7 & 10 (64Bit)