産業用CPUボード

RM-N8MP

SMARC™ 2.1 Module with NXP Arm® i.MX 8M Plus Quad-core Cortex-A53 Processor

  • NXP i.MX 8M Plus Quad-core Cortex-A53 1.6GHz processor
  • Up to 2.3 TOPS NPU
  • 3GB LPDDR4, 16GB eMMC on board
  • Extensive peripheral I/O support
  • Validated with Yocto 4.0 and Android 11
  • Long-term availability with NXP solution
  • Compliant with SMARC™ 2.1
  • Ruggedized and fanless design
  • Wide-range operating temperature (-40°C ~ 85°C)
  • Wide Temperature
CPU NXP i.MX 8M Plus Quad-core Cortex-A53 processor
PCH N/A
Memory System memory: 3GB LPDDR4 on board (option: 4/8GB)
Data memory: 16GB eMMC on board (up to 256GB)
BIOS N/A
Watchdog Timer N/A
H/W Monitor N/A
Storage Device Interface 3x High-speed SDIO (eMMC/SD)
Expansion Slots SMARC connector to carrier board
Graphics Controller OpenGL ES 1.1/2.0/3.0/3.1, OpenCL 3.0, OpenVG 1.1, OpenGL 4.0, EGL 1.5, Vulkan 1.1
Video Output 1x MIPI-DSI 4-lane up to 1920 x 1080 at 60 Hz
1x 2-ch LVDS 4-lane (1-ch LVDS mux with MIPI-DSI)
1x HDMI
Ethernet 2x GbE with YT8531H LAN PHY on board
I/O Chipset N/A
Serial Port 4x UART, 2x SPI
USB 2.0 N/A
USB 3.X 2x USB 3.0 with OTG interface
Serial ATA N/A
Audio 2x I²S
TPM N/A
Others NPU: up to 2.3 TOPS 12x GPIO, 4x I²C, 2x CAN FD, 1x PCIe interface
Image capture: 1x MIPI CSI-2 4-lane, 1x MIPI CSI-2 2-lane
Video codec: 1080p/60fps decode & encode (AVC/ H.264, HEVC/H.265, VP8, VP9)
Dimensions (L x W) 82mm x 50mm (3.2" x 2")
Power Consumption N/A
Operating Temperature -40°C ~ +85°C (-40°F ~ +185°F)
Storage Temperature N/A
Relative Humidity 0% ~ 90% RH @60°C (non-condensing)
RM-N8MP NXP i.MX 8M Plus Quad-core Cortex-A53 1.8GHz processor, 3GB LPDDR4, 16GB eMMC

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