Embedded Computing


Compact Expandable Fanless System with 9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors (35W TDP)

Fanless system with IBASE MB230 customized board9th/8th Gen Intel® Core™ i7/i5/i3 Desktop ProcessorsDual SIM slots supports WWAN redundancy4x RJ45 Gigabit Ethernet port (2x Supports 802.3at PoE+)3x M.2 (B-Key/E-Key/M-Key)Supports Over/Under/Reverse voltage protectioniSMART, iAMT (11.6), TPM (2.0)

The AMI230 is a robust embedded system based on the 9th/8th Gen Intel® Core platform. Developed for smart factory, industrial automation, AIoT and other applications in harsh environments, the rugged AMI230 delivers exceptional computing and graphics performance with an extended operating temperature range of -20°C to 70°C, operating vibration up to 3Grms and over/under/reverse voltage protection.

The AMI230 series houses the Intel® Q370 MB230AF motherboard and is equipped with multiple high speed I/O including 8x USB 3.1, 4x COM, and 3x M.2 (B-Key, E-Key & M-Key) for NVMe storage, WiFi and 4G/LTE options, and HDMI/DP/DVI-D display interface. It also features four Gigabit Ethernet ports making it highly suitable for network related applications, iAMT (11.6) for system remote management and repair, TPM (2.0) security for preventing phishing attacks, and iSMART green technology for power on/off scheduling and power resume functions.

All models in the series come with 8GB of DDR4 memory that is expandable to 32GB, a 64GB MLC industrial-grade SSD, and 12V or 18V~24V wide-range DC input. Operating systems supported are Windows 10 (64-bit) / Windows 7 (32-bit & 64-bit), and Linux Ubuntu / Fedora 24. The basic AMI230 model measures 210x285x77mm (WxDxH). The AMI231 and AMI232 variations support optional expansion cards featuring PCI, PCIe (x1), PCIe (x8), PCIe (x16), 2x COM (COM5 & COM6), 1x SATA II, and 2x USB 2.0.

System Mainboard MB230AF with Intel® Q370 PCH
CPU Type 9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors
System Speed Up to 4.0 GHz
Memory 2x DDR4-2666/2400 SO-DIMM, Max. 32GB
Front Panel External I/O 2x RS232/422/485 port for COM#1~COM#2
2x RS232 ports for COM#3~COM#4
1x DisplayPort (1.2)
2x RJ45 Gigabit Ethernet port (Supports 802.3at PoE+)
1x 5-pins DC-in terminal block type for 12V(±10%) or 18V(-10%) ~ 24V(+10%)
2x Antenna holes
Rear Panel External I/O 1x DVI-D + HDMI(1.4)
4x USB 3.1 ports
2x Antenna holes
2x RJ45 Gigabit Ethernet ports + dual USB 3.1 stack ports
1x Red HDD LED
1x power button with Green LED indicator
1x 2-pin terminal block
2x SIM card
Storage 1x 2.5'' HDD/SSD
1x M.2 (B-Key Supports USB2.0 for 4G/LTE)
1x M.2 (E-Key Supports PCI-E + USB2.0 for CNVi)
1x M.2 (M-Key Supports PCI-E(4x) + SATA for NVMe SSD)
Construction Aluminum & steel
Chassis Color Silver & Gray
Mounting Desktop & wall mount
Dimensions 210mm(W) x 285mm(D) x 77mm(H)
8.27” (W) x 11.22” (D) x 3.03” (H)
Weight 4kg
Operating Temperature -20°C to 70°C (-4°F~158°F) (for 35W CPU)
Storage Temperature -20°C~80°C (-4°F~176°F)
Relative Humidity 10~95%, non-condensing @60 degree C
Vibration Operating : 3Grms / 5~500Hz
Shock Operating : 20G / 11ms
Non-operating : 40G / 11ms
Certification CE/ FCC Class A/ LVD
AMI230AF (Supports SIERRA module) Fanless box System with MB230AF, w/ Intel® Core™ i7/i5/i3 desktop Processor, 4x COM, 1x 8GB memory, 1x 2.5” 64GB MLC industrial-grade SSD, w/o power adaptor
270W Power Adaptor Kit (optional) 270W (24V@11.25A) power adaptor kit Compatible with IEC62368-1/EN62368-1
Optional Accessories Global 4G antenna kit for Sierra Wireless EM7565 module, M.2 (M-Key 2280) Thermal kit

Model Chipset Video Audio Network Others
AMI230/AMI231/AMI232 Intel(R) Chipset Software Installation UtilityWindows10 Intel(R) HD GraphicsWindows10 Realtek High Definition AudioWindows10 Intel(R) NetworkWindows10 Intel(R) ME 12.XWindows10