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RISC平台
RM-QCS610
搭载Qualcomm QCS610处理器的宽温SMARC 2.1模组
- Qualcomm QCS610 SoC
- Up to 4GB LPDDR4, 32GB eMMC
- Qualcomm Adreno 612 GPU 3D graphics accelerator with 64-bit addressing 845 MHz
- 4K video capture and playback at 30fps
- 3.15 TOPS @Caffe
- Validated with Linux open Embedded
- Long-term availability with Qualcomm solution
- Compliant with SMARC™ 2.1
- Carrier board for RM-QCS610 SMARC™ 2.1 CPU module
- Supports 12V~24V DC-in jack, reset, power, LID button, RTC battery
- Supports Gigabit LAN, audio, USB OTG, HDMI, COM (RS232/422/485)
- With Micro SD socket, mPCI-E with USB on board
- Supports TTL, HDMI, MIPI-DSI Display, MIPI-CSI camera
- Wide-range operating temperature (-30°C~85°C)
RM-QCS610 SMARC 2.1模块搭载Octa 8核心Qualcomm高通QCS610处理器，其专为现正热门AI人工智能边缘运算与机器学习商机量身打造，可供应用在视觉增强型无人机、高端智能视频会议相机、以及智能机器人等领域。
此低功耗的RM-QCS610模块不仅提供弹性化的I/O接口，并具有强大的视觉边缘运算能力，可在内建感应器或摄影机的设备上加速AI运作，同时搜集、处理资料、做决策并执行任务，相当适合用来收集与分析交通数据、执行制造业的计算机视觉需求、或进行自动化安全验证工作。
RM-QCS610 配备 Qualcomm Adreno 612 GPU 3D 图形加速器，支持4K影像撷取和30fps 播放，高达4GB LPDDR4，32GB eMMC、并可支持两个智能相机，其支持-30°C至+80°C宽温范围，在恶劣环境下仍能正常运作。 除了提供高可靠度并可长期供货之外，此模块还通过了Open Linux Embedded 5.414.04和Android 12 （2023/2，CS）的OS操作系统验证，并可外接RP-105载板，用来扩充 Micro SD、Mini PCI-E、TTL、HDMI、MIPI-DSI 以及 MIPI-CSI 相机等功能。
| Form Factor | SMARC™ 2.1 |
| Processor | QCS610 Kryo Gold: Dual high-performance cores 2.2 GHz Kryo Silver: Hexa low-power cores 1.8 GHz |
| System Memory | On board - 4GB LPDDR4/ 32GB eMMC |
| Flash Memory | 32GB eMMC |
| Display | 1x HDMI TX (Up to 1920 x 1080 at 60 Hz) 1x MIPI DSI TX (Up to 1920 x 1200 at 60 Hz) Controlled by SW1 switch |
| Video Codec | 4K30 8-bit H.264/HEVC/VP8/VP9 Multi-format codec up to 4K30 video encode Multi-stream codec (4K30) (HEVC) + 720p30 (YUV) + 480p30 (VA-YUV) Dual 14-bit image signal processing (ISP) + Lite ISP: 24 MP (2x IFE + 1x IFE Lite, 16 + 16 + 2 MP), 4K30, MCTF, SHDR, C-PHY, DPHY 4K30 8-bit H.264/HEVC/VP8 |
| Graphics | Adreno 612; 845 MHz, 3D graphics accelerator with 64-bit addressing |
| Audio Interface | 1x I²S |
| LAN | 1x GbE LAN |
| USB | 3x USB 2.0 ( Type-A) 1x USB3.0 (Micro-B, With OTG Support) |
| Image Capture Interface | 1x MIPI CSI 2Lane (Up to 1920 x 1080 at 30 FPS) 1x MIPI CSI 4Lane (Up to 4208 x 3120 at 30 FPS) |
| Serial Interface | 1x UART 2Wire, 2x UART 4Wire, 2x SPI |
| Media Interface | N/A |
| PCI-E | N/A |
| SATA | N/A |
| GPIO | 12x GPIO |
| I²C | 4x I²C |
| Others | RTC |
| CAN Bus | N/A |
| Dimensions | 82mm x 50mm (3.2” x 2”) |
| Environment | Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins |
| Operating Temperature | -30°C ~ +80°C (-22°F ~ 176°F) |
| OS Support | Linux open embedded / Other OS (by request) |
| Certification | CE/ FCC Class-A |
| RM-QCS610 | Industrial grade SMARC™2.1 CPU module, Qualcomm QCS610 SoC, 4GB LPDDR4, 32GB eMMC |
| HSRMQCS610-B | Heat sink for IBASE RM-QCS610 series module |
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