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| Form Factor | Carrier Board Compliant with SMARC™ 2.1 |
| Edge I/O | 1x DC-in jack (12V~24V) 1x RJ45 GbE LAN 1x Headphone & Mic 3x USB 2.0 host 1x USB 3.0 host (with USB 2.0/3.0 OTG support) 1x HDMI 1x COM (RS232/422/485) 1x SD slot |
| Internal I/O | 2x CAN bus 2.0B 1x MIPI display power (3.3V) 1x MIPI-DSI 2x MIPI-CSI2 6x GPIOs (3.3 V) 2x RS232 (RX/TX / pin header) 1x I²C 1x I²S 1x M.2 E-Key (2230) (USB 2.0 interface only) 1x Speaker R and L 1x RTC battery 1x TTL (3.3V reserved for debug) |
| Jumpers, Switches & Buttons | 1x Boot select switch (Refer to Qualcomm CRB) 1x Power button 1x Reset button 1x LID button |
| Power Input | 12V~24V DC-in |
| Dimensions | 170mm x 170mm (6.7"x 6.7") |
| Environment | Humidity: 0% to 90% RH at 60° C (non-condensing) |
| Operating Temperature | -30°C ~ +85°C (-22°F ~ 185°F) |
| OS Support | Based on the CPU module |
| Certification | CE/FCC Class A |
| RP-105 | Carrier Board for SMARC™2.1 modules,12V~24V DC-in, Mini-ITX, Mini PCI-E with USB, Gigabit LAN, USB OTG, HDMI, CSI MIPI bus, 6x GPIO, 2x RS232, 1x RS232/422/485, VDDIO=3.3V |
| 产品数据表 | RP-105 |
| 产品型录 | RISC-Based Embedded Solutions (Vol.24.03) |
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