嵌入式主板
IB966
3.5寸单板计算机 - 搭载Intel® Core™ Ultra 300系列处理器
- Intel® Core™ Ultra 300 Series Processor (up to 180 TOPS)
- 2x DDR5 SO-DIMM, Max. 128GB
- Supports HDMI,DisplayPort (DisplayPort connector & Type-C), LVDS and eDP
- 2x 2.5G LAN, 3x USB 3.2(Type-C&Type-A), 3x USB 2.0, 2x COM
- 3x M.2 slots (M2280+M2242+E2230), 12V~24V DC-in
- Digital I/O (4-in/4-out), iAMT, dTPM & Watchdog Timer
高效能IB966 3.5吋单板计算机,搭载Intel® Core™ Ultra系列3处理器(Panther Lake平台),在最高规格配置下,可提供高达180 TOPS的整体AI运算效能,为边缘端即时AI推理、机器视觉、资料分析及工业自动化应用提供强大运算能力。

IB966可搭载Intel Core Ultra X7 358H、Intel Core Ultra 7 356H或Intel Core Ultra 7 355处理器,于单一平台整合CPU、GPU与NPU运算资源。其异质运算架构可依不同工作需求,将运算任务分配至最合适的处理单元,加速边缘端即时决策,同时降低延迟、网路流量及对云端运算的依赖。双DDR5-7200 SO-DIMM插槽最高支援128GB记忆体,可满足资料密集型边缘AI应用及高效多工处理需求。
IB966提供丰富的连接与扩充介面,包括两组2.5GbE、USB 3.2、USB 2.0及两组RS232/422/485。显示输出支援HDMI、DisplayPort、具备DisplayPort功能的USB Type-C、LVDS及eDP,并配置三个M.2插槽,可支援高速NVMe储存及无线连线。其他功能包括12V–24V直流电源输入、数位I/O、Intel® AMT主动管理技术、独立式TPM及可程式化看门狗计时器,提升系统建置的安全性、管理效率与运作可靠性,适用于机器视觉、智慧制造、智慧交通、医疗影像、智慧零售及其他高效能边缘AI应用。
| CPU | Intel® Core™ Ultra 300 Series Processor |
| PCH | N/A |
| Memory | 2x DDR5 SO-DIMM, 7200MT/s, Non-ECC, Max.128GB |
| BIOS | AMI |
| Watchdog Timer | 256 levels |
| H/W Monitor | Yes |
| Storage Device Interface | 2x M.2 (M2280& M2242 for NVMe) |
| Mini Type Slots | 1x M.2 (M2280, supports NVMe only) 1x M.2 (M2242, supports NVMe only) 1x M.2 (E2230, supports CNVi) |
| Graphics Controller | Intel® Core™ Ultra 300H Processor built-in Xe3 Graphics |
| Video Output | HDMI, DisplayPort (DisplayPort connector & Type-C), LVDS and eDP |
| Ethernet | Intel® I226LM as 1st LAN, I226V as 2nd LAN |
| I/O Chipset | Fintek F81804U-I on board |
| Serial Port | 2x RS232/422/485 |
| USB 2.0 | 3x USB 2.0 (1x Type-A ; 2x via pin headers) |
| USB 3.X | 1x USB 3.2 (Type-C), 2x USB 3.2 (Type-A) |
| Serial ATA | N/A |
| Audio | Intel® Core™ Ultra processor built-in HD audio + ALC888S codec |
| TPM | dTPM |
| Others | Digital I/O (4-in/4-out), iAMT; +12V~+24V DC-in |
| Dimensions (L x W) | 102mm x 147mm (4“ x 5.8“) |
| Power Consumption | TBD |
| Operating Temperature | 0°C~60°C (32°F~140°F) |
| Storage Temperature | -20°C~80°C (-4°F~176°F) |
| Relative Humidity | 10% ~ 90% (non-condensing) |
| IB966AF-358H | Intel® Core™ Ultra X7 358H SoC, onboard 3.5" SBC, w/ dual 2.5Gb, HDMI + 2x DisplayPort (DisplayPort connector & Type-C), LVDS & eDP, 2x COM, 3x M.2, supports iAMT& dTPM, DC-in (12V~24V),Optional heatsink |
| IB966AF-356H | Intel® Core™ Ultra 7 356H SoC, onboard 3.5" SBC, w/ dual 2.5Gb, HDMI + 2x DisplayPort (DisplayPort connector & Type-C),LVDS & eDP 2x COM, 3x M.2, supports iAMT& dTPM, DC-in (12V~24V),Optional heatsink |
| IB966AF-355 | Intel® Core™ Ultra 7 355 SoC, onboard 3.5" SBC,w/ dual 2.5Gb, HDMI + 2x DisplayPort (DisplayPort connector & Type-C),LVDS & eDP, 2x COM, 3x M.2, supports iAMT& dTPM, DC-in (12V~24V),Optional heatsink |
| HSIB966-B | Heatsink with fan for IB966 |
| HSIB962-2 | Heat Spreader for IB966 |
| IB76A-3 | Cable Kit w/ USB, COM & Power |
| 产品数据表 | IB966 |
| 产品型录 | Embedded Computing (Vol.2605) |
| 使用手册 | IB966 V1.0 (IBASE Server) IB966 V1.0 (Google Drive) |
| 驱动程序 - 主板 | IB966 Driver DVD |
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