嵌入式计算机
ET977
AMD Ryzen™ 嵌入式 V1000/ R1000系列 COM Express Type 6 (R3.0) CPU计算机模块
- Onboard AMD Ryzen™ Embedded V1000/ R1000 Series
- 2x DDR4-2400 SO-DIMM sockets, Max. 32GB, ECC compatible
- Supports 4x independent displays (HDMI/DVI/DisplayPort, LVDS, and eDP) via the carrier board
- 4x USB 3.1, 8x USB 2.0, 2x SATA III
- Supports TPM (2.0)
ET977为低功耗的COM Express Basic Type 6电脑模组,此模组以AMD Ryzen™嵌入式SoC为架构,最高可支援四个4K独立显示器,相当适合应用于AIoT、零售、医疗、交通运输、自动化和游戏机等各式领域。
The ET977 is a low-power COM Express Basic Type 6 modules based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields. It allows users to deliver basic embedded solutions with a new class of performance and power efficiency. Built with the AMD Ryzen™ Embedded V1000/R1000 SoC, the board is very suitable for modular designs and platforms that require high scalability to meet customers' time-to-market needs.
The new ET977 provides powerful computing with 'Zen' CPU cores and excellent image processing performance with the integrated AMD Radeon Vega graphics with 3 compute units to deliver stunningly visual experiences. It features four (V1000) or three (R1000) independent displays (HDMI/DVI/DP, LVDS or eDP) with up to 4K UltraHD resolutions and two DDR4 SO-DIMM slots for up to 32GB memory and with ECC compatibility.
The unit provides a wealth of advanced connectivity options including 2x serial, 4x USB 3.1, 8x USB 2.0, and 2x SATA 6Gb/s ports, as well as high-speed PCIe 3.0 lanes. Measuring 125mm x 95 mm, the Computer-on-Module is available in V1807B and V1605B variants for high computing and R1606G variant for low-power applications. Both Windows 10 and Linux Ubuntu are supported.
CPU | Onboard AMD Ryzen™ Embedded V1000 / R1000 Series |
PCH | N/A |
Memory | 2x DDR4 SO-DIMM, Max. 32GB |
BIOS | AMI |
Watchdog Timer | 256 levels |
H/W Monitor | Yes |
Storage Device Interface | N/A |
Expansion Slots | V1000 Series: 1x PEG(8x)(Gen3), 4x PCI-E(1x)(Gen3), 2x PCI-E(1x) R1000 Series: 1x PEG(4x)(Gen3), 3x PCI-E(1x)(Gen3), 3x PCI-E(1x) |
Graphics Controller | AMD Radeon™ Vega GPU integrated |
Video Output | V1000 Series: 3x DDI R1000 Series: 2x DDI 1x LVDS or 1x eDP (By option) |
Ethernet | Intel® I211AT or I210AT Gigabit LAN |
I/O Chipset | Fintek F81804U-I |
Serial Port | 2x UART (Tx/Rx only) |
USB 2.0 | 8x USB2.0 Port [USB 2.0 Hub x 3 ports, (VL822-Q7)] |
USB 3.X | 1x USB3.1 port (10G), 3x USB3.1 ports (VL822-Q7) |
Serial ATA | 2x SATA III via carrier board |
Audio | AMD Ryzen™ built-in HD audio controller |
TPM | TPM (2.0) |
Others | Digital I/O (4in/4-out) |
Dimensions (L x W) | 125mm x 95mm (4.92" x 3.74") |
Power Consumption | AMD V1605B w/ 2x 8GB DDR4-2133, +12V: 3.28A AMD R1606G w/ 2x 8GB DDR4-2133, +12V: 3.43A |
Operating Temperature | 0°C~60°C (32°F~140°F) |
Storage Temperature | -20°C~80°C (-4°F~176°F) |
Relative Humidity | 90% (non-condensing @60°C) |
ET977-1605LV | COM Express (Type-6) CPU Module with AMD Ryzen™ V1605B QC APU (2.0GHz~3.6GHz), DDR4 dual-channel memory, LVDS support |
ET977-1606LV | COM Express (Type-6) CPU Module with AMD Ryzen™ R1606G DC APU (2.6GHz~3.5GHz), DDR4 dual-channel memory, LVDS support |
ET977-1505LV | COM Express (Type-6) CPU Module with AMD Ryzen™ R1505G DC APU (2.4GHz~3.5GHz), DDR4 dual-channel memory, LVDS support |
HSET977-A | Heatsink with fan for ET977 |
HSET977-1 | Heat Spreader for ET977 |
产品数据表 | ET977 |
产品型录 | Embedded Computing (Vol.23) |
使用手册 | ET977 V1.0 |
驱动程序 - 主板 | ET977 Driver DVD |
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