嵌入式计算机

ET876

Intel® Atom® x7/x5 COM Express Type 10 (R3.0) CPU计算机模块

  • Onboard Intel® Atom® x7-E3950/ x5-E3940/ x5-E3930 Processor [i-Temp support]
  • Onboard DDR3L memory with ECC support
  • 1x Intel® I210IT Gigabit LAN
  • Supports TPM (2.0), eMMC5.0 (optional)
  • Wide-range operating temperature from -40°C to 85°C
  • 15 years life time
  • Wide Temperature

ET876为内建Intel® Atom® E3900系列、Celeron® N3350或Pentium® N4200处理器的COM Express Type 10 (R3.0)电脑模组。它利用多核处理器技术打造高性能运算和弹性的可编程图形功能,且支援-40°C到85°C宽温运作,使其成为当今任务关键型物联网、运输、医疗、军事和工业自动化等应用的理想选择。


The ET876 COM Express Type 10 CPU Module (R3.0) supports Intel's energy-efficient Atom® Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance computing and flexible programmable graphics, making it ideal for today's mission-critical IoT, transportation, medical, military, and industrial automation applications.


ET876 COM Express

The highly integrated ET876 comes in a compact form factor (84 x 55mm) and matches the performance requirements of cost-effective, small footprint embedded systems. It benefits from the Intel Gen9 graphics engine featuring DirectX 12, OpenGL 4.3 and OpenCL 2.0 to deliver stunning graphics and 4K resolution output, as well as simultaneous display combinations of DDI and LVDS or eDP. Connectivity options on the carrier board can include 8x USB 3.0, 2x USB 3.0, and 2x SATA III. All models support Gigabit connectivity, 4GB DDR3L with ECC standard, TPM hardware security and up to 32GB of eMMC storage.


The ET876 operates with an extended temperature range of -40°C to 85°C for remote outdoor deployments depending on the processor used and runs both Linux and Windows 10 operating systems.

CPU Intel Atom® x7-E3950 Processor (1.6GHz~2.0GHz)
Intel Atom® x5-E3940 Processor (1.6 GHz~1.8GHz)
Intel Atom® x5-E3930 Processor (1.3 GHz~1.8GHz)
PCH Integrated in Intel® SoC
Memory Onboard memory, DDR3L 1600MHz, 4GB with ECC
BIOS AMI
Watchdog Timer 256 levels
H/W Monitor Yes
Storage Device Interface eMMC 5.0 up to 32GB (optional)
Expansion Slots 4x PCI-E(x1)
Graphics Controller Intel® SoC integrated Gen9-LP graphics
Video Output 1x DDI
1x LVDS or 1x eDP (optional)
Ethernet Intel® I210IT PCI-E Gigabit LAN
I/O Chipset F81804U-I
Serial Port 2x UART (Tx/Rx only))
USB 2.0 8x USB 2.0 via Carrier Board
USB 3.X 2x USB 3.0 via Carrier Board
Serial ATA 2x SATA III
Audio Intel® Atom® SoC built-in HD audio controller
TPM TPM (2.0)
Others I2C
Dimensions (L x W) 84mm x 55mm (3.3" x 2.17")
Power Consumption Intel® Atom® E3950 1.6GHz w/ 4GB LDDR3L 1600
+12V: 1.42A
Operating Temperature -40°C ~ 85°C (-40°F~185°F)
Storage Temperature -40°C ~ 90°C (-40°F ~ 194°F)
Relative Humidity 90% (non-condensing @60°C)
ET876-X7LV COM Express (Type-10) CPU Module with Intel® Atom® x7-E3950 (2.0GHz) on board, LVDS, 4GB DDR3L memory on board
ET876-X5QLV COM Express (Type-10) CPU Module with Intel® Atom® x5-E3940 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board
ET876-X5LV COM Express (Type-10) CPU Module with Intel® Atom® x5-E3930 (1.8GHz) on board, LVDS, 4GB DDR3L memory on board
IP417 Mini-ITX COM Express Type-10 (R3.0) Carrier Board
HSET876-1 Heat spreader for ET876-420/ 335
HSET876-X-1 Heat spreader for ET876-X7/ X5Q/ X5
HSET876-A Heat sink w/ FAN for ET876-420/ 335
HSET876-X-A Heat sink w/ FAN for ET876-X7/ X5Q/ X5
HSET876-X-B Heat sink w/o FAN for ET876-X5 (only temp -40°C~80°C)
产品数据表 ET876
产品型录 Embedded Computing (Vol.23)
使用手册 ET876

驱动程序

Model Chipset Video Audio Network Others
ET876/ET875/ET870

Intel Chipset

Windows 10

Intel Apollolake Graphics

Windows 10

Realtek High Definition Audio

Windows 10

Intel I21x

Windows 10

Intel TXE

Windows 10

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